6NSILICA PURITY
99.9999% purity for precision polishing and slurry formulation.
ULTRA-HIGH-PURITY COLLOIDAL SILICA
6N99.9999% PURITY
Ultra-high-purity colloidal silica with minimized impurity content. Particle size, density and other key parameters can be customized to your application.
SiO2 / MATERIALS, WITH POSSIBILITY.01 — A CLOSER LOOK
MINIMIZED
IMPURITIES
Metal impurity content ≤1 ppb for purity-sensitive applications.
CUSTOM PARTICLE
SIZE & DENSITY
Particle size, density and other key parameters tailored to your requirements.
01 / THE MATERIAL
Small particles.
A world of possibility.
An essential material.
A more considered way to source it.
Colloidal silica is a dispersion of fine silicon dioxide particles in a liquid. In precision polishing, it can serve as the abrasive foundation of a formulated slurry.
Our 6N (99.9999%) purity colloidal silica combines minimized impurity content with customizable particle size, density and other key parameters. Tell us your substrate, process and target specifications.
What matters when choosing a grade02 / EXPLORE THE POSSIBILITIES
Where precision takes shape.
Start with your application.
Build the material brief around it.
APPLICATION SPOTLIGHT 01 / 03Ultra-high-purity silica abrasives for CMP at process nodes below 14 nm. Match the grade to your substrate, formulation and polishing process.
Explore abrasive options for glass and optical surface finishing. Share your material, surface targets and process conditions to guide grade selection.
Start an application-specific discussion for sapphire and other precision substrates. Suitability and polishing performance need to be validated in your process.
Application areas are illustrative. Grade suitability is subject to evaluation.
03 / PRODUCT
Ultra-high-purity
colloidal silica.
6N99.9999% SILICA PURITY
Minimized impurities.
Customized to your specifications.
30–100 nm silica particles with CV ≤5% and metal impurities ≤1 ppb. Particle size, density and other key parameters can be tailored to your application.
Colloidal silica is an abrasive input; a formulated CMP slurry may include additional chemistry.
EDITORIAL SAMPLE CONCEPTPRODUCT / SPECIFICATIONS
Your process.
Your parameters.
6N purity. Particle size, shape and solids content tailored to your process.
Silica purity
6N
99.9999%
Particle size
30–100 nm
Customizable
Uniformity
CV ≤5%
Particle-size uniformity
Shape
Customizable
Particle morphology
Metal impurities
≤1 ppb
Minimized impurity content
pH
Grade-specific
Solids content
Customizable
SiO2 · wt%
6N refers to silica purity, not dispersion solids content. Test methods and batch reports are to be confirmed.
View parameter details
- Grade & particle size
- Particle size: 30–100 nm. Particle-size coefficient of variation (CV): ≤5%. Grade names and measurement methods to be confirmed.
- Shape & solids content
- Particle shape and solids content are customizable. Available morphologies and solids-content ranges (wt%) are confirmed against your requirements.
- pH
- Confirmed by product grade. The pH range, stabilizer and test conditions are to be confirmed.
- Impurities & customization
- Metal impurity content: ≤1 ppb. Elements covered, reporting basis, analytical methods and surface-modification options to be confirmed.
PRODUCT / THE DETAILS
From specification
to supply.
Documents, samples and supply.
The essentials, at a glance.
Technical documents
TDS · SDS · batch CoA
Application evaluation
Semiconductors · optics · sapphire
Packaging
Container · pack size · labeling
Storage & handling
Temperature · shelf life · handling
Samples & delivery
Samples · MOQ · lead time
Technical support
Grade selection · customization
Grade-specific documents, validated test data, packaging options and supply terms are to be confirmed.
What will be confirmed?
- Documentation & testing
- Purity and impurity reports, CoA, quality-control information, applicable certificates and application test conditions.
- Packing & storage
- Container sizes, labels, net weight, storage conditions, shelf life and product / dispatch photographs.
- Samples & supply
- Sample volume, cost, shipping, MOQ, lead time, destination and technical-support scope.
04 / FACTORY
A closer look
at the campus.
A view of the campus.
Factory and production details will follow.
05 / THE PONY BAZAAR APPROACH
Materials expertise starts
with a conversation.
Bringing our cross-border sourcing perspective
to your advanced-material needs.
- 01 ↗
Share your brief.
Tell us what you’re polishing, what matters in your process and where the material needs to go.
- 02 ↗
Evaluate the fit.
Discuss candidate grades, technical information and a sample evaluation plan before committing.
- 03 ↗
Plan the supply.
Align on the specification, packaging, commercial terms and delivery requirements for your order.
A LITTLE MORE CLARITY
Before we begin.
Is colloidal silica the same as a CMP slurry?
Not exactly. Colloidal silica is a dispersion of silica particles and can provide the abrasive component of a slurry. A formulated CMP slurry may combine that abrasive with other chemicals selected for the substrate and process. Tell us whether you need an abrasive input or a formulated polishing solution.
Can particle size and density be customized?
Yes. Particle size, density and other key parameters can be tailored to your requirements. Share your substrate, process conditions and target specifications to discuss a suitable grade.
Can I start with a sample?
Use “Discuss a sample” to share your application and requested volume. Sample availability, cost, shipping and evaluation requirements will be confirmed for your inquiry.
Which specifications and documents should I request?
Start with particle size, distribution, density, solids content, pH, stabilizer and critical impurity limits. Specify your needs for a technical data sheet (TDS), safety data sheet (SDS) and certificate of analysis (CoA). Available documents are confirmed for each proposed grade.
How are pricing and delivery arranged?
Pricing, minimum order quantities, packaging and delivery terms depend on the selected grade, quantity and destination. Include these details in your inquiry so the conversation starts with your actual requirements.
LET’S FIND YOUR STARTING POINT.
What are you
working on?
A new formulation. A demanding surface. A better supply conversation.
Tell us where you want to go.